pb rohs ecm2a4e2a16-19.660m ecm2a 4 e 2 a 16 -19.660m series rohs compliant (pb-free) 2.0mm x 2.5mm 4 pad ceramic smd crystal frequency tolerance 15ppm maximum frequency stability 15ppm maximum operating temperature range -20c to +70c nominal frequency 19.660mhz load capacitance 16pf parallel resonant mode of operation at-cut fundamental electrical specifications nominal frequency 19.660mhz frequency tolerance 15ppm maximum frequency stability 15ppm maximum aging at 25c 3ppm/year maximum operating temperature range -20c to +70c load capacitance 16pf parallel resonant shunt capacitance (c0) 5pf maximum equivalent series resistance 100 ohms maximum mode of operation at-cut fundamental drive level 100watts maximum spurious response -3db minimum; fo to fo +5000ppm storage temperature range -40c to +90c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 1, hbm: 1500v fine leak test mil-std-883, method 1014, condition a flammability ul94-v0 gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-883, method 2002, condition b moisture resistance mil-std-883, method 1004 moisture sensitivity j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010, condition b vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev b 3/11/2011 | page 1 of 4
ecm2a4e2a16-19.660m mechanical dimensions (all dimensions in millimeters) pin connection 1 crystal 2 cover/ground 3 crystal 4 cover/ground line marking 1 19.6 2 yzz y=last digit of year zz=week of the year 0.5 0.3 1.0 (x4) 1.2 (x4) www.ecliptek.com | specification subject to change without notice | rev b 3/11/2011 | page 2 of 4 2.50 0.10 2.00 0.10 0.55 max 0.65 0.10 0.95 0.10 marking orient a tion 1 2 3 4 0.675 0.100 (x4) 0.775 0.100 (x4) all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ecm2a4e2a16-19.660m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev b 3/11/2011 | page 3 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ecm2a4e2a16-19.660m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev b 3/11/2011 | page 4 of 4
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